AUTO TECH China 2026 —Automotive Computing Expo

It showcases software-defined vehicles, chip innovation, AI, and E/E architectures shaping tomorrow's automotive industry.
Automotive OEMs and Tier 1 suppliers visit the exhibition to find suppliers and partners.

AUTO TECH China 2026—the Automotive Computing Expo will take place from November 27-30, 2026 at the China Import and Export Fair Complex (Area D) in Guangzhou. As one of 8 themed exhibitions held inside AUTO TECH China 2026, It will attract more than 500 companies to show the latest technologies and products, together with other important topics such as automotive electronics, automotive chassis systems, EV/HV, lightweight, smart cockpit, test and automotive interiors. Meanwhile, the event organizer will invite OEMs and Tier 1 suppliers to visit the show such as GAC, BYD, Nissan, Toyota, Honda, Tesla, XPENG Motors, Dongfeng, Changan, SAIC, Geely, GM, Mercedes-Benz, BMW, Volkswagen, NIO, Xiaomi, Bosch, Continental, Yanfeng, Faurecia, DENSO and any others from China and all over the world.

Exhibit Profile

1. Automotive Computing & Chips：Autonomous driving central computing platform, cockpit domain controller, domain controller, MCU, GPU, FPGA, AI chips, IGBT/SiC,Sensor chips, memory chips.
2, Software-Defined Vehicle & OS, Vehicle operating syste: QNX, Linux, Android, RTOS. software development tools： Middleware、Simulation software, autonomous driving algorithms, SOA architecture software, AUTOSAR toolchain. Intelligent cockpit software: HMI design, intelligent voice interaction system, augmented reality (AR) engine.
3. Intelligent Driving & Sensors AV, ADAS L2-L4、V2X. Sensors: LiDAR, millimeter-wave radar, ultrasonic radar, camera sensors, high-precision positioning, integrated navigation systems.
4. Automotive Electronics & Connectivity Intelligent cockpit hardware: In-vehicle display screen, head-up display system (HUD), full LCD instrument panel, integrated cockpit-driver terminal. In-vehicle network: In-vehicle Ethernet, CAN bus, in-vehicle wireless communication (5G/V2X), data security and gateway. 
5. Wiring Harnesses, Connectors, and Testing Technologies (Components & Testing) Connectivity Technologies: Automotive wiring harnesses, connectors, electronic circuit boards, sensor assemblies. Testing and Measurement: Autonomous driving simulation testing, EMC testing (electromagnetic compatibility), chip reliability testing, software functional safety testing (ISO 26262).
6. New Energy and Electrical & Electronic Architecture (EV & EE Architecture) Three-electric System: Battery Management System (BMS), Motor Controller, Electric Control System, Braking/Steering System. Electrical & Electronic Architecture: Zone-based architecture, High-voltage power distribution unit.

The agenda of the Automotive Computing Technology Forum includes:
AI & Computing Architecture: The paradigm shift from "Software-Defined" to "AI-Defined" vehicles
Core Hardware: Breakthroughs and mass production of indigenous automotive-grade chips (e.g., cockpit‑driving integrated SoCs)
Software Ecosystem: Open‑source collaboration on vehicle operating systems and the leapfrog development of domestic foundational software
Cross‑domain Integration: Digital twin and the digital & intelligent transformation of R&D; cloud‑vehicle collaboration
Frontier Exploration: L4 high‑level autonomous driving and the ultimate form of the "smart mobility lifeform"